Transceiver configuration for millimeter wave wireless communications
US11190224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2020 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W72/0453
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.