Method and system for in situ sintering of conductive ink
US11191167B2 · kind B2 · utility
2Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2016 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Jul 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a conductive element is disclosed. The method being executed by an additive manufacturing system and comprises: dispensing a modeling material on a receiving medium to form a layer, and dispensing a conductive ink on the layer of modeling material to form a conductive element. In some embodiments of the invention the modeling material comprises a sintering inducing agent, and in some embodiments of the present invention a sintering inducing composition is dispensed separately from the modeling material and separately from the conductive ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.