Patent · US Active

Method for producing a cohesive laser bond connection and apparatus for forming a laser bond connection

US11192206B2 · kind B2 · utility

0Cited by

3References

16Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Andreas Alves Goncalves Do Curral · Bad Tabarz, DE
Andreas Heider · Munich, DE
Bernd Jahrsdoerfer · Gerstungen, DE
Christoph Bantel · Ditzingen, DE
Emilia Schwindt · Stuttgart, DE
Friedhelm Guenter · Burgstetten, DE
Nathanael Eisenreich · Leonberg, DE
Ronny Wolf · Eisenach, DE

Key dates

Filing date	Jun 7, 2019
Grant date	Dec 7, 2021
Priority date	—
Expiry date	Dec 17, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E60/10
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Methods for producing a cohesive laser bond connection, wherein, in a first method step, a bond element (2) made from copper is provided, in a second method step, a contact element (3) made from copper is provided, and, in a third method step, the bond element (2) and the contact element (3) are connected to one another in a joined fashion under the action of green laser radiation (1).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.