Method and apparatus for improved surface cure for three dimensional printed parts
US11192299B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Apr 25, 2017 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Dec 23, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/243
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for curing a three dimensional (3D) printed part is disclosed. For example, the method includes adding a layer of a build material, curing the layer of the build material using a first light source having a first wavelength, repeating the adding and the curing using the light source having the first wavelength for a predefined number of layers, adding a final top layer of the build material to form the 3D printed part and curing the final top layer of the build material using a second light source having a second wavelength that is different than the first wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.