Films for use as interleaves between substrates
US11192338B2 · kind B2 · utility
1Cited by
8References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2018 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Jun 16, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2423/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Films may be used as interleaves between hard and non-compressible surfaces such as surfaces of sheets or plates made of glass, metal, such as steel, polycarbonate, and/or poly(methyl methacrylate). The films may be embossed and/or may include a foamed core layer having a plurality of micro-voids. In particular, the films may include a polyolefin, a basis weight of between about 30 gsm and about 70 gsm, an embossed thickness of between about 150 microns and 800 microns, and a stiffness of between about 150 grams and about 750 grams according to the Circular Bend Stiffness Test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.