Patent · US Active

System and method for laser marking substrates

US11192389B2 · kind B2 · utility

0Cited by
2References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 1, 2017
Grant dateDec 7, 2021
Priority date
Expiry dateDec 5, 2038

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB41J2/44
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

A laser marking system comprises at least one controller to control an array of optical devices, between a laser source and a scan head. The array applies a selected pattern of portions of the received spatial profile of the laser beam to the substrate to achieve a second intensity different from the first intensity of laser beam at a rate of power deposition relative to a rate of thermal diffusion in the substrate for a predetermined time interval to thermally heat locations of the substrate with the selected pattern of the portions. The second intensity effectuates carbonization of materials of the substrate to create a mark without ablation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.