System and method for laser marking substrates
US11192389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2017 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Dec 5, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/44
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A laser marking system comprises at least one controller to control an array of optical devices, between a laser source and a scan head. The array applies a selected pattern of portions of the received spatial profile of the laser beam to the substrate to achieve a second intensity different from the first intensity of laser beam at a rate of power deposition relative to a rate of thermal diffusion in the substrate for a predetermined time interval to thermally heat locations of the substrate with the selected pattern of the portions. The second intensity effectuates carbonization of materials of the substrate to create a mark without ablation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.