Electronic assembly and pressure measurement device with improved durability
US11192776B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2019 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Oct 9, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.