Method for manufacturing bent substrate and bent substrate
US11192815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2018 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Nov 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a bent substrate, which forms a bent part in at least a part of a substrate, in which the substrate includes a second region and a first region, the method for manufacturing including: supporting the first region of the substrate on a substrate support surface of a support member including a mold surface having a same curved surface shape as that of the bent part and the substrate support surface that supports the first region, in a state of facing the second region of the substrate to the mold surface; heating the second region of the substrate to soften the second region of the substrate by the heating; placing the second region along the mold surface of the support member by an own weight of the second region; and transferring the curved surface shape of the mold surface to the second region by an external force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.