Polyamide composition and molded article
US11192979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Mar 30, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan δ peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000≤Mw≤35,000. The invention also provides a molded article or the like formed using the polyamide composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.