Slurry composition and method of selective silica polishing
US11193044B2 · kind B2 · utility
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Key dates
| Filing date | Aug 2, 2017 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polishing selectivity of silica over crystalline silicon of at least 100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.