Systems, assemblies, and methods of reducing head loss in heating devices
US11193291B2 · kind B2 · utility
0Cited by
21References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Aug 10, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/877
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Low head loss systems are detailed. The systems may include chambers having low impedance to water flow therethrough and repositionable gates or other valves within the chambers. The valves may direct water as a function of whether an associated heating device is active. At least some gates may incorporate poppet valves or other high-flow by-passes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.