Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks
US11194059B2 · kind B2 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2020 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Jul 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.