Patent · US Active

Electronic power module

US11195778B2 · kind B2 · utility

0Cited by

2References

7Claims

0Family size

Assignees

AUDI AG · DE
ABB Schweiz AG · CH

Inventors

Andreas Apelsmeier · Pollenfeld, DE
Günter Vetter · Burladingen, DE

Key dates

Filing date	Nov 24, 2016
Grant date	Dec 7, 2021
Priority date	—
Expiry date	May 7, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13055
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic power module, including at least one semiconductor component, which is arranged on a support, as well as a cooling element, which is in thermal contact with the semiconductor component, wherein the support includes a semiconductor material and, at the same time, serves as a cooling element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.