Electronic module for motherboard
US11195779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2020 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Mar 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.