Semiconductor device sub-assembly
US11195784B2 · kind B2 · utility
0Cited by
18References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2016 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Jul 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
We disclose herein a semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a semiconductor unit locator comprising a plurality of holes, wherein each semiconductor unit is located in each hole of the semiconductor unit locator; a plurality of pressure means for applying pressure to each semiconductor unit, and a conductive malleable layer located between the plurality of pressure means and the semiconductor unit locator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.