Semiconductor chips and method for producing semiconductor chips

US11195974B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Roland Enzmann · Regensburg, DE
• Lorenzo Zini · Regensburg, DE
• Vanessa Eichinger · Wenzenbach, DE
• Jochen Brendt · Regensburg, DE

Key dates

• Filing date: Sep 25, 2018
• Grant date: Dec 7, 2021
• Expiry date: Nov 23, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/034

Abstract

A semiconductor chip may include a substrate and a semiconductor body positioned thereon. The semiconductor body has a first semiconductor layer and a second semiconductor layer with an active zone sandwiched therebetween. At least one current spreading layer is designed to electrically contact the first semiconductor layer positioned between the substrate and the semiconductor body. A metal layer is designed to electrically contact the second semiconductor layer positioned between the substrate and the current spreading layer where the metal layer fully covers the current spreading layer. An insulating layer may be positioned between the current spreading layer and the metal layer in the vertical direction to where the metal layer is electrically insulated from the current spreading layer.