Laser processing systems and associated methods of use and manufacture

US11198193B2 · kind B2 · utility

Assignee

• UNIVERSAL LASER SYSTEMS, INC. · US

Inventors

• Yefim P. Sukhman · Phoenix, US
• Mikhail E. Ryskin · Phoenix, US
• Matt Ricketts · Scottsdale, US
• David T. Richter · Tempe, US
• Stefano J. Noto · Mesa, US
• Lucas Gilbert · Scottsdale, US
• Jonathan S. Marx · Scottsdale, US
• Craig Beiferman · Scottsdale, US
• Christian J. Risser · Scottsdale, US

Key dates

• Filing date: Feb 15, 2019
• Grant date: Dec 14, 2021
• Expiry date: Oct 30, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/0869
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Systems and methods for laser processing systems and associated methods for using and manufacturing such systems are disclosed herein. In some embodiments, a laser processing system includes a controller, a laser source, a material support, and a beam delivery subsystem operably coupled to the controller. The beam delivery subsystem comprises an optical carriage assembly configured to receive and modify a laser beam from the laser source, and direct the laser beam toward a material to be processed carried by the material support. The optical carriage assembly is further configured to focus the laser beam within a material processing field to obtain an adjustable power density within a material processing plane and achieve an optimal selected condition for the material to be processed.