Cutting elements with wear resistant diamond surface
US11199051B2 · kind B2 · utility
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4References
22Claims
0Family size
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Key dates
| Filing date | Oct 8, 2018 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Mar 30, 2039 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5735
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.