Method for manufacturing light emitting diode filament
US11199298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2020 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application discloses a method for manufacturing an LED filament, which includes: operation , a plurality of metal sheets are provided and arranged at least two rows in parallel; operation S2, a plurality of brackets are provided, and each bracket is located between two corresponding metal sheets and fixedly connected to the two metal sheets; operation S3, a plurality of LED chips are provided and attached to each of the brackets, and the LED chips are electrically connected to the metal sheets by conducting wire; operation S4, each bracket, the LED chips defined on the bracket, the conducting wire defined on the bracket, and the joints of the bracket and the metal sheets are all cladded using packaging material to form an encapsulation layer, and the encapsulation layer, the bracket, the LED chips, the conducting wire, and the connected two metal sheets cooperatively form an LED filament.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.