Pressure sensor system having a land grid array/mold premold structure and method for its manufacture
US11199463B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2018 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Oct 12, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor system including at least one pressure sensor unit configured as a system-in-package, the pressure sensor unit encompassing a supporting structure including a cavity and a sensor element situated in the cavity; the supporting structure being formed by a land grid array/mold premold structure (LGA/MPM) and signal-processing elements being integrated into and/or on the supporting structure; the pressure sensor unit being introduced into a pressure sensor housing provided with a diaphragm and being supported therein, and a residual volume of the pressure sensor housing provided with at least one diaphragm being filled with an incompressible fluid; and the pressure sensor housing including a groove extending around the pressure sensor unit, in which a sealing ring is situatable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.