Self-sensing of printed polymer structures
US11199517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2019 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Jan 10, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C64/106
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structural health monitoring method is provided that utilizes self-sensing printed polymer structures. The method is based on resistivity properties of conductive materials, which can be integrated to a 3D printed polymer structure during additive manufacturing. An article to be monitored has at least one 3D printed polymer structure including a circuit comprising at least one conductive pathway extending through a non-conductive material. The resistance across the circuit is measured during or after loading of the article to determine a resistance value. The measured resistance value is compared to a known resistance value, and based on the comparison, a defect can be detected in the 3D printed polymer structure. Structural health monitoring systems and articles with integrated structural health monitoring are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.