Vapor chamber on heat-generating component
US11201103B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2019 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | May 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.