Semiconductor device with conductors embedded in a substrate
US11201106B2 · kind B2 · utility
6Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2020 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Jan 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure includes a first substrate having a front side and a back side and a second substrate having a front side and a back side, wherein the back side of the second substrate is attached to the back side of the first substrate. The structure further includes a device layer over the front side of the second substrate; a first conductor going through a semiconductor layer in the second substrate; and a conductive connection that connects the first conductor to a conductive feature in the device layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.