Solid-state imaging device and electronic apparatus
US11201185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/9202
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a solid-state imaging device including a first substrate that includes a pixel unit, a first semiconductor substrate, and a first multi-layered wiring layer stacked, a second substrate that includes circuit, a second semiconductor substrate, and a second multi-layered wiring layer stacked, the circuit having a predetermined function, a third substrate that includes a circuit, a third semiconductor substrate, and a third multi-layered wiring layer. The first substrate and the second substrate being bonded together such that the first multi-layered wiring layer is opposite to the second semiconductor substrate, and a first coupling structure for electrically coupling the circuit of the first substrate with the circuit of the second substrate, the first coupling structure is on bonding surfaces of the first substrate and the second substrate, and includes an electrode junction structure in which electrodes on the respective bonding surfaces are joined to each other in direct contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.