Heat dissipating structure capable of conducting heat from a detachable module to a case module, and electronic device therewith
US11202391B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Sep 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20709
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating structure is for conducting heat generated by a detachable module to a case module. The heat dissipating structure includes a driving component disposed on a side of the detachable module, a driven component pivotally disposed on the case module and a heat dissipating component connected to the driven component. The driving component is slidable relative to the case module along with the detachable module. The heat dissipating component is for abutting against the detachable module and the case module. When the detachable module slides relative to the case module along an installing direction, the driving component drives the driven component to pivot relative to the case module in a first pivoting direction to drive the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.