Multi-layered structure for the production of a floor covering with sound-insulating and indentation-resistant properties
US11203186B2 · kind B2 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2040 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F15/0215
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A multi-layered structure (1) for the production of a floor or wall covering. The structure comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.