Polymer, organic layer composition, and method of forming patterns
US11203662B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jul 21, 2017 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Mar 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a polymer including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, an organic layer composition including the polymer, and a method of forming patterns using the organic layer composition.The Chemical Formulae 1 and 2 are the same as defined in the specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.