High temperature resistant masking adhesive composition
US11203704B2 · kind B2 · utility
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2References
22Claims
0Family size
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Key dates
| Filing date | Mar 20, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Mar 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.