Acoustic absorber with integrated heat sink
US11204204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Jun 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal management assembly is provided for both removing heat and absorbing acoustic energy. The thermal management assembly includes a heat sink base component and a plurality of thermally conductive fins disposed in a sparsely-arranged array in thermal communication with the heat sink base component. Each fin defines a two-sided Helmholtz unit cell disposed in a periodic array extending from the heat sink base component. Each unit cell includes a lossy resonator and a lossless resonator. The lossy resonator includes a first chamber portion bounded by at least one first boundary wall defining a first chamber volume, and a first neck forming an opening in the first chamber portion. The lossless resonator includes a second chamber portion bounded by at least one second boundary wall defining a second chamber volume, and a second neck forming an opening in the second chamber portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.