Semiconductor device test socket
US11204369B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2018 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Oct 23, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.