Apparatus for high-efficiency fiber-to-chip coupling and mode-conversion to integrated photonics platform
US11204469B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2020 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Jun 1, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In an example, an optical coupler includes a waveguide structure. The waveguide structure includes a waveguide layer having a proximal end and a distal end. The waveguide layer includes a first waveguide that extends from the proximal end along a first portion of the waveguide layer and widens along a second portion of the first waveguide layer toward the distal end. The waveguide layer further includes one or more additional waveguides that extend from the proximal end along the first portion of the waveguide layer. Each of the one or more additional waveguides narrow along the second portion of the waveguide layer to separate distal tips at the distal end. The waveguide structure is configured to match an integrated photonics mode to a fiber mode supported by an optical fiber at the proximal end and transition the mode to only the first waveguide toward the distal end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.