Base body with soldered-on ground pin, method for its production and uses thereof
US11205610B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2018 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Oct 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to components, such as base bodies, for feed-through elements including a metallic base body, at least one through-opening for receiving a functional element in a fixing material, such as an electrically insulating fixing material, and at least one conductor, which is connected electrically conductively to the base body by a soldered connection. The soldered connection includes a metallic solder material that covers a surface region of the base body and thus forms a soldering region on a surface of the base body. The base body has, at least in the soldering region, a microstructuring that includes at least depressions in the surface of the base body. The present disclosure similarly relates to methods for producing such base bodies and to applications thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.