Thermal interfacing assembly for a power module with in-place curing
US11205810B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Dec 3, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal interfacing assembly for use in a power module having at least one battery module and a cooling plate, and corresponding method of forming the thermal interfacing assembly. The thermal interfacing material is deposited over a first surface of the cooling plate such that the thermal interfacing material conforms to the shape of the first surface. The thermal interfacing material is configured to be electrically insulating and thermally conductive. A first embedded heater is positioned adjacent to the thermal interfacing material. The first embedded heater includes an electrically-conductive portion and a resistive portion. The battery module is installed adjacent to the first embedded heater such that the first embedded heater is directly in contact with a first face of the battery module. The first embedded heater is employed to at least partially induce in-place curing of the thermal interfacing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.