Housing assembly, antenna assembly, and electronic device
US11205850B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2020 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Jun 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q15/0026
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A housing assembly, an antenna assembly, and an electronic device are provided according to the present disclosure. The housing assembly includes a dielectric substrate and a radio-wave transparent structure. The dielectric substrate has a first transmittance for a radio frequency signal in a preset frequency band. The radio-wave transparent structure includes a first radio-wave transparent layer and a second radio-wave transparent layer coupled with the first radio-wave transparent layer. The first radio-wave transparent layer and the second radio-wave transparent layer are indirectly stacked together, and the radio-wave transparent structure at least partially covers the dielectric substrate. A region of the housing assembly corresponding to the radio-wave transparent structure has a second transmittance for the radio frequency signal in the preset frequency band, and the second transmittance is larger than the first transmittance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.