Electronic device and wiring structure thereof
US11206734B1 · kind B1 · utility
2Cited by
1References
20Claims
0Family size
Inventors
Key dates
| Filing date | Jun 8, 2020 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Jun 8, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.