Heat dissipation structure, camera and mobile platform
US11206744B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Dec 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The embodiments of the present disclosure provide a heat dissipation structure, applied to an electronic device. The electronic device includes a power consumption element, and the power consumption element disposed in an accommodation cavity. The heat dissipation structure includes a cover, configured to cover and seal the accommodation cavity. The cover is thermally connected to the power consumption element through a heat-conducting element. The heat dissipation structure further includes a heat-dissipation component, thermally connected to the cover and including a heat-dissipation module and a fan. The heat-dissipation module is disposed in an air outlet channel of the fan, such that the wind generated by the fan takes away the heat of the heat-dissipation module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.