High purity polypropylenes and polypropylene compositions for molding
US11208510B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jul 22, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2800/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to high purity polypropylenes and polypropylene compositions suitable for injection molding in which the polypropylene is characterized by a percentage of 2,1-insertions, relative to the total number of propylene molecules in the polymer chain, of at least 0.2%; a melting temperature Tm ranging from 140° C. to 160° C. as determined according to ISO 3146; a ratio of frequencies at fixed modulus of 1000 Pa for storage shear modulus (G′) and loss shear modulus (G″) greater than 4.7; a molecular weight distribution (MWD) of at least 2.5; a number average molecular weight (Mn) of at most 45 kg/mol and Carreau-Yasuda parameters η0, b and τ complying with the relationship: 2.18−1.715(b)−0.015(Ln η0)2+0.944(b)2+0.0149(Ln η0)(Ln τ)+0.0095(Ln τ)2>1 when fitted to the CY equation, said CY parameters η0, b and τ are determined from a dynamic rheology analysis (RDA).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.