Patent · US Active

High purity polypropylenes and polypropylene compositions for molding

US11208510B2 · kind B2 · utility

0Cited by
11References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 12, 2018
Grant dateDec 28, 2021
Priority date
Expiry dateJul 22, 2038

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08F2800/20
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to high purity polypropylenes and polypropylene compositions suitable for injection molding in which the polypropylene is characterized by a percentage of 2,1-insertions, relative to the total number of propylene molecules in the polymer chain, of at least 0.2%; a melting temperature Tm ranging from 140° C. to 160° C. as determined according to ISO 3146; a ratio of frequencies at fixed modulus of 1000 Pa for storage shear modulus (G′) and loss shear modulus (G″) greater than 4.7; a molecular weight distribution (MWD) of at least 2.5; a number average molecular weight (Mn) of at most 45 kg/mol and Carreau-Yasuda parameters η0, b and τ complying with the relationship: 2.18−1.715(b)−0.015(Ln η0)2+0.944(b)2+0.0149(Ln η0)(Ln τ)+0.0095(Ln τ)2>1 when fitted to the CY equation, said CY parameters η0, b and τ are determined from a dynamic rheology analysis (RDA).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.