Thermal signature control structures
US11208568B2 · kind B2 · utility
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29Claims
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Key dates
| Filing date | May 16, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Dec 3, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/204
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Subwavelength conducting particles can be arranged on conducting surfaces to provide arbitrary thermal emissivity spectra. For example, a thermal emissivity spectrum can be tailored to suppress a thermal signature of an object without sacrificing radiative cooling efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.