Single-component thermosetting epoxy resin having high scouring resistance
US11208580B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jul 21, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/36
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 μm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.