Use of semi-aromatic copolyamide for transporting refrigerant fluid
US11209105B2 · kind B2 · utility
0Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2020 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Mar 1, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2400/121
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a method for heating or cooling a liquid or a body by means of a vapor compression circuit containing a heat transfer fluid. The vapor compression circuit element includes at least one layer that includes copolyamide of formula X/10.T/Y, where the structural variables are described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.