Heat dissipation device
US11209214B2 · kind B2 · utility
0Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Apr 16, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2280/08
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.