Liquid encapsulation device and method for fabricating the same
US11209329B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/0247
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A liquid encapsulation device for embedding sensor is provided. The liquid encapsulation device comprises a substrate having an upper surface with a central concave portion; at least one protection layer sealed on the upper surface of the substrate; and at least one sensor fixed on the protection layer. Wherein, the central concave portion is filled with liquid and the sensor is arranged above the central concave portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.