Methods and apparatuses for compensating for moisture absorption
US11209377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2020 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jan 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A technique to characterize moisture in a dielectric layer of a printed circuit board is provided. A method comprises applying a test signal to test circuitry comprising a test capacitor that is formed with the dielectric layer of the printed circuit board; measuring at least one characteristic of a least one of signal transmission and signal reflection from the test circuitry; and determining, from the at least one measured characteristic, at least one parameter value indicative of moisture content in the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.