Method for inserting a wire into a groove of a semiconductor chip
US11209799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jun 4, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.