Semiconductor device
US11211339B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.