Method of producing an optoelectronic component

US11211524B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Daniel Leisen · Regensburg, DE
• Herbert Brunner · Sinzing, DE
• Emilia Dinu · Regensburg, DE
• Jens Eberhard · Lemgo, DE
• Christina Keith · Neutraubling, DE
• Markus Pindl · Tegernheim, DE
• Thomas Reeswinkel · Regensburg, DE
• Daniel Richter · Bad Abbach, DE

Key dates

• Filing date: Jul 31, 2018
• Grant date: Dec 28, 2021
• Expiry date: Dec 10, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882

Abstract

A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.