Semiconductor apparatus
US11212908B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2017 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jan 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10757
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.