Board level shield for electrical assembly
US11212939B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Jun 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A board level shield includes shield walls forming a shield chamber sized and shaped to receive an electrical component mounted to a host circuit board. The shield walls provide electrical shielding entirely around the shield chamber for the electrical component. The shield walls extend between a top and a bottom configured to be mounted to the host circuit board and connected to a ground layer of the host circuit board. The board level shield includes a shield opening at the top bounded by the shield walls and sized and shaped to receive a thermal bridge to allow the thermal bridge to extend through the shield opening to interface with the electrical component. The board level shield includes shield fingers extending from the shield walls into the shield opening. The shield fingers are configured to engage the thermal bridge at separable mating interfaces to electrically connect the shield fingers to the thermal bridge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.