Thermally conductive silicone composition
US11214651B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Jun 12, 2017 |
| Grant date | Jan 4, 2022 |
| Priority date | — |
| Expiry date | Nov 20, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.