Array substrate, method for manufacturing the same, and display apparatus
US11215893B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 28, 2018 |
| Grant date | Jan 4, 2022 |
| Priority date | — |
| Expiry date | Jul 24, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13458
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the present disclosure provide an array substrate, a method for manufacturing the same, and a display apparatus. The array substrate includes a plurality of pad structures located in a bonding region and a plurality of data leads located in a lead region. Each data lead corresponds to one pad structure. The pad structure includes at least two pad electrodes insulated from each other. In the pad structure, each pad electrode is electrically connected to the data lead corresponding to the pad structure, respectively, to form different signal writing paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.